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If you are verifying returned BGA devices with damaged balls, this is an application note for you. The following procedure leads you through the steps to save time and money during this process.


Deball, Test Verification of Chip, Reball, Retest

Using two types of ET BGA sockets to test in this situation will save you the reballing expense when you know the part is not functional.


When a BGA device fails in a system the part is removed from the system. During the removal process the balls are often damaged. Instead of reapplying new balls and testing the device it is more cost effective to remove all the balls and then test the device for functionality. If the devices proves to be functional then reball the device, test and the chip is ready to be reused.

The Problem:

A BGA device without balls requires an LGA socket to test the device. A BGA socket cannot be used to test a BGA device without balls.

Solution Method:
  1. Take BGA device in question and remove balls.
  2. Retest device in an LGA LPW Emulation Technology socket.
  3. If part passes tests reball part.
  4. Retest device with balls in a BGA BPW socket.

How ET Can Help:

Consult your local ET representative for the following hardware:
  1. SMT or Thru-Hole LGA production sockets.
  2. SMT or Thru-Hole BGA production sockets.
  3. Reballing preforms and preform fixtures.

For other applications similar to this one please call our technical support sales team at 1-800-ADAPTER (232-7837) or log on to our website and click on Ask a Technical Question, Ask ET.

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