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DEVELOPMENT SOCKETS
Home > Catalog > Sockets > Development > Clamshell
 
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Elastomer
Custom
Knob Lock
Lever Lock
Quick Lock
Screw/Twist Lock

IC Development Sockets

Development Sockets are high-performance sockets targeted to the R&D phase of IC or system design and development.


Standard Process Development Sockets

Our "Standard Process Development Sockets" are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. These are available with 5, 7, 10 or 15-day expedited lead times, with a standard 5-week delivery. These sockets utilize our patented pin technology, providing a variety of mounting methods, 3GHz bandwidth, heatsink options, and a list of other features. These are available for any package size, pin/ball count and pitch down to 0.5mm. Please click here for ET's Development Socket Overview

Choose from five DUT retention styles:
Twist/Screw Lock
Twist Lock Socket

uses a torque screwdriver to mount the lid
Knob Lock
Knob Lock Socket

uses a built-in knob to mount the lid
Quick Lock
Quick Lock Socket

uses a pair of thumb clasps to mount the lid
Lever Lock
Lever Lock Socket

uses levers to mount the lid
Clamshell
Clamshell Socket

uses a clamshell-type latch
to mount the lid

Theses sockets are available in four PCB mounting styles:
  • SMT: uses paste to reflow the socket to the same target footprint as the IC
  • Raised SMT: uses paste to reflow the socket to the same target footprint as the IC, but uses longer pins to allow the socket body to clear adjacent components
  • Compression Mount: bolts to the target PCB. Avoids the need to reflow the socket, but requires pre-existing tooling holes in the PCB
  • Through-Hole
  • : through-hole pins reflow into holes in target PCB
SMTThrough-HoleCompression

Custom Development Sockets

Our "Custom Development Sockets" are custom designed to meet your requirements. These sockets are available for all package styles: uBGA, BGA, CSP, MLF/QFN, SOP, QFP, modules, die and custom packages. They are available for any package size, pin/ball count and pitch down to 0.3mm. The socket's contact element is optimized for the application. Various contact elements are available: pogo-pin, elastomer, capped spring, PCB embedded contact, etc. Custom designs give a multitude of options, including higher bandwidths, lower contact forces, meeting z-height requirements, etc.

Custom Development Sockets
BGA Sockets ASAP Service

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