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Hi-Lo Flexible Interconnect Systems

HiLo Sockets

Technical Specifications

Material Specifications

Pin
Phos-Bronz, plated with Gold (10 µ") over Nickel (100 µ")
    Custom plating thickness available

Contact 
Dual beam, beryllium copper, plated with  Gold (10 µ") over Nickel (100 µ")

Pin & Socket Carrier Material
FR-4 glass epoxy laminate
    Custom carrier materials available

Electrical Specifications

Pin Self-Inductance*
    1.25 nH

Mutual-Inductance*
    0.120 nH

Shunt-Resistance*
    800 Ohms

Mutual-Capacitance*
    0.030 pF

*Results from GigaTest Labs Electrical Characterization Test.  Request a full copy of the test report here.

Qualification Testing - Tests Performed

Low Level Circuit Resistance (LLCR)
Vibration 
Mechanical Shock
Insulation Resistance (IR)
Dielectric Withstanding Voltage (DWR)
Thermal Shock
Humidity (Thermal Cycling)
Engagement and Separation Force
Mating and Unmating Force
Thermal Aging
Durability
Normal Force
Current Carrying Capacity
Characteristic Impedance
Voltage Standing Wave Ratio (VSWR)
Propagation Delay Via Time Domain Transmission (TDT)
Crosstalk Via Network Analysis (Frequency Domain)
Loop Inductance

*Tests performed by Contech Research.  Request a copy of the test report here.

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