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CONVERT ANY KNOWN GOOD PCB TO A TEST FIXTURE FOR CHIP SCREENING OR FAILURE ANALYSIS

This system ensures complete screening capabilities for sorting marginal or non-functional BGA circuits. The BGA System is built upon ET's BPE (Base Package Emulator) which accommodates thru-hole accessories via its top while the bottom is soldered to the PCBs BGA footprint, taking the place of the chip.

The Socket and Probing System is used by hardware, software, design and test engineers who have a need to screen a particular chip package. This can also be used to develop, debug, program, qualify or test BGA devices.

BGA CHIP SCREENING

  • Available for quick screening with a known good PC board
  • Prevents time-consuming board revisions
  • Easy installation
  • Easily removable
  • Socket options are available for low profile (minimal clearance) needs
  • Allows for rapid, new design capabilities
  • Requires no extra tooling holes or extra space on the target PCB

1.00mm Pitch Ball Pitch
Ball Count BGA Grid Size
Ball Pitch (mm)
Description
Drawing
196 14 X 14 1.00 ZR-MBGA-196-3-014-1
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223 18 X 18 1.00 ZR-MBGA-223-3-018-1
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376 22 X 22 1.00 ZR-BGA-376-3-022-1
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748 34 X 34 1.00 ZR-MBGA-748-3-034-1
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876 30 X 30 1.00 ZR-MBGA-876-3-030-1
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1936 44 X 44 1.00 ZR-MBGA-1936-3-044-1
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1.27mm Pitch Ball Pitch
Ball Count BGA Grid Size
Ball Pitch (mm)
Description
Drawing
244 16 X 16 1.27 ZR-BGA-244-2-016-1
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256 20 X 20 1.27 ZR-BGA-256-2-020-1
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272 20 X 20 1.27 ZR-BGA-272-2-020-1
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324 20 X 20 1.27 ZR-BGA-324-2-020-1
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352 26 X 26 1.27 ZR-BGA-244-2-016-1
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388 26 X 26 1.27 ZR-BGA-388-2-026-1
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432 31 X 31 1.27 ZR-BGA-432-2-031-1
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624 25 X 25 1.27 ZR-BGA-624-2-025-1
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BGA Chip Screening

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