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Emulator Adapters Wired 1 to 1
Home > Emulator Adapters >DIP to LAP - SMT
 
PLCC Clip-On
LCC, PGA, PLCC - Socketable
PQFP - Socketable
DIP Female to LAP - SMT
DIP Female to SOIC - SMT
DIP Female to SSOP, TSSOP- SMT
DIP Female to TSOP - SMT
PGA, PLCC, PQFP, SOIC, SSOP, TSOP - SMT
SDIP Female to SOIC - SMT
QFN/MLF (3-in-1 Adaptor)
BPE/FPA BGA Emulator Systems
BPE BGA Emulator Bases
FPA BGA Emulator Pin-Fields (pads on top)
FPA-BL BGA Emulator Pin-Fields (solder balls on top)
XPA BGA Emulator Extended Length Pin-Field (pads on top)


DIP to LAP Emulator Adapters

DIP to SOIC Package Converters

These adapters enable you to adapt 6 to 32-pin DIPs to LAP-type footprints.  These devices have a two-piece construction: a top DIP assembly with interconnects to a LAP surface-mountable assembly that is soldered to the target PC board and then, the top assembly is plugged onto it.

Features

  • Adapters can be used for prototyping SMT boards with DIP devices
  • Provide interconnects to SMT patterns for testing
  • Constructed with gold-plated machined pin contacts for high reliability

How to Order

1)  Locate the part number with the correct number of pins from the emulator pod and target socket. 
2)  Locate your footprint in the footprint section.
3)  All parts are wired 1-to-1, top to bottom.
 
Ordering Information Example
EMULATOR POD DIP => TARGET LAP PADS
Description Top Socket Bottom Socket Lead Pitch (mm) Body Size (mm) PDF
AS-DIP.3-008-LAP2S-1 0.3" DIP 2 piece LAP 1.27 4.90 x 6.00 PDF
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