IC PACKAGING

ET specializes in application specific organic semiconductor packages with pin counts from 8 to 1,000+.  Our packages have been qualified by leading semiconductor companies including Fairchild, Intel, Motorola and Philips.

Examples of ET Packages

(click image to enlarge)

LCoS Optical Die Package	Multi-Die BGA Package
PPGA package, 557 I/O	Optical Die - DIP Package
Package with integrated voltage regulator	Package for die characterization

ET has designed over 150 packages for applications ranging from high performance, moderate volume to low cost, high volume. With our design tools and over a decade of experience, we can turn a design for a project in 1 to 2 weeks.

Contact us with your die size, number of wire bonds, wattage, and total I/O and we will respond with an initial proposal within one day.

Features

• Die can be directly attached to integrated heat sink to improve heat dissipation
• ET Pin Grid Array (PGA) packages are ideal for die with low temperature ceilings. By using a PGA package, die can be inserted into socket rather than being exposed to solder reflow temperatures
• Cavity-up and cavity-down designs available
• In addition to providing the package only, ET can provide turnkey assembly - die attach, wire-bond and encapsulation

Click here to request more information or a quote.

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