Chip-On-Board / Chip-On-Flex / Bare Die Assemblies
ET's factory is a leading edge, integrated electronics manufacturing facility. In addition to conventional electronics assembly, we offer wire-bonding and flip-chip technology for chip on board and chip on flex applications. Utilizing bare die will ensure cost savings while effectively reducing the size of your next generation products.
Examples of ET Die Assemblies
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ET's broad bare die capabilities include:
Bare die on any substrate - FR4, thin board, flex, rigid flex, exotic materials