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Few Chip Modules

Design/cost benefits


I/O for ET Few Chip Modules can be BGA, PGA, microPGA (50 mil center), or lead frame.
  • Minimization of trace length between high performance components
  • Elimination of microvias on motherboard
  • Reduction of layer count on motherboard
  • Selective population on a common motherboard
  • Isolation of high-performance components from motherboard
  • Pre-tested modules for high-cost components
  • As packages change, ET can redesign the module, to avoid requiring customers to requalify the motherboard
  • ET can also incorporate an on-board voltage regulator to accomodate different chip voltages

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Tel: 1-800-ADAPTER, (1-800-232-7837)
Fax: (408) 982-0664


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